Could CPUs and RAM merge soon? This top CEO thinks so

SK Hynix CEO plans major shake-up

When you purchase through links on our site, we may earn an affiliate commission.Here’s how it works.

A convergence ofmemorywith some of the computing functions of theCPUis the only way to extract more performance from the hardware going forward, one leading tech CEO has claimed,

Seok-Hee Lee, CEO ofSK Hynix, the world’s second-largest memory manufacturer behindSamsung, shared his predictions at the Institute of Electrical and Electronics Engineers’ International Reliability Physics Symposium (IRPS).

“There will be a convergence of memory and logic. The concept is to add a few computing functions of CPU to DRAM,” said Lee as reported byThe Register.

Computing in memory

Lee also gave details about the evolution of memory from the currency generation of high-bandwidth memory (HBM).

The next evolution, Processing Near Memory (PNM) will bring both the CPU and the memory within a single module. To further improve the performance, the CPU and the memory will be placed within a single package called Processing in Memory (PIM).

For maximum performance though, we’ll have to look towards Computing in Memory (CIM) where the CPU and the memory are integrated within the same die.

Lee went as far as to suggest that this merger can only happen with increased collaboration between the companies in the semiconductor industry ecosystem.

Are you a pro? Subscribe to our newsletter

Sign up to the TechRadar Pro newsletter to get all the top news, opinion, features and guidance your business needs to succeed!

According toThe Register, Lee spent a lot of time talking about SK Hynix’s upcoming breakthroughs that will help the company deliver faster, higher-capacity memory.

“We are improving materials and design structures for technical evolution in each field of DRAM and NAND, and solving the reliability problems step by step. If the platform is innovated successfully based on this, it is possible to achieve the DRAM process below 10 nanometers (nm) and stack over 600 layers of NAND in the future,” Lee said.

This will be a significant bump up for SK Hynix that currently leads the industry with its 176-layer NAND flash.

Via:The Register

With almost two decades of writing and reporting on Linux, Mayank Sharma would like everyone to think he’sTechRadar Pro’sexpert on the topic. Of course, he’s just as interested in other computing topics, particularly cybersecurity, cloud, containers, and coding.

iStorage Group acquires Kanguru Solutions as it looks to expand security offering

Phishing attacks surge in 2024 as cybercriminals adopt AI tools and multi-channel tactics

Arcane season 2 finally gave us the huge Caitlyn and Vi moment we’ve been waiting for – and its creators say ‘we couldn’t have done it in season one’